The Mobile Wallet functionality has caught the wind in Asia-Pacific market and in some parts of Europe too but North American market is still lagging behind. Well, NXP Semiconductors in collaboration with Sony Corporation will develop and ship contactless IC platform that will enable customers to make payments directly from their mobile phones.
The chip will entrench the MIFARE and FeliCa contactless technologies that will allow the cellphone users to access leverage services from any location. The two global leaders expect to push the mobile wallet concept strongly be developing the chip next year.
Via: theWirelessspot